MEC1-105-02-F-D
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Beryllium Copper |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Manufacturer Package Identifier | MEC1-105-02-F-D |
| Operating Temperature | -55°C~125°C |
| Packaging | Tube |
| Series | MEC1 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Termination | Solder |
| ECCN Code | EAR99 |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 10 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Voltage - Rated | 300V |
| Additional Feature | POLARIZED |
| Subcategory | Headers and Edge Type Connectors |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Loop Bellows |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.039 1.00mm |
| Current Rating | 2.2A |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 0.376 inch |
| Number Of PCB Rows | 2 |
| Number of Contacts | 8 |
| PCB Contact Pattern | RECTANGULAR |
| Body Depth | 0.356 inch |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Body/Shell Style | SOCKET |
| Mating Contact Row Spacing | 0.05 inch |
| Height | 9.14mm |
| Contact Finish Thickness | 3.00μin 0.076μm |
| Plating Thickness | FLASH inch |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
MEC1-105-02-F-D Overview
Material was packaged according to Tube's specifications.It is recommended that you mount the device using mounting type Surface Mount.Connecting the device to the computer is accomplished by using the connector socket CARD EDGE CONNECTOR.It is indicated by MEC1 that the device is a series device.Additional features of this chip include: POLARIZED
MEC1-105-02-F-D Features
MEC1 series
MEC1-105-02-F-D Applications
There are a lot of Samtec Inc. MEC1-105-02-F-D Edgeboard Connectors applications.
- Communications
- Instrumentation and test equipment
- Battery Operated Systems
- Wireless local loop
- Telecommunications
- CMOS Image sensors for mobile applications
- 4-channel data acquisition
- Medical Instrumentation and medical imaging
- Medical Imaging
- AC motor control
