MEC1-130-02-L-D-NP-A-K-TR
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Beryllium Copper |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2009 |
| Series | MEC1 |
| JESD-609 Code | e3 |
| Feature | Board Guide, Pick and Place |
| Pbfree Code | yes |
| Part Status | Active |
| Termination | Solder |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 60 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Subcategory | Headers and Edge Type Connectors |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Loop Bellows |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.039 1.00mm |
| Total Number of Contacts | 60 |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Body Length or Diameter | 1.36 inch |
| Number Of PCB Rows | 2 |
| PCB Contact Pattern | RECTANGULAR |
| Body Depth | 0.356 inch |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Mating Contact Row Spacing | 0.05 inch |
| Contact Finish Thickness | 10.0μin 0.25μm |
| Plating Thickness | 10μin |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
MEC1-130-02-L-D-NP-A-K-TR Overview
The material was packaged in accordance with the specifications provided by Tape & Reel (TR).There is a recommendation to mount using type Surface Mount.Connection to the device is made through the connector socket CARD EDGE CONNECTOR.Board Guide, Pick and Place features are present on the device.In the MEC1 field, the series of the device is indicated.
MEC1-130-02-L-D-NP-A-K-TR Features
MEC1 series
MEC1-130-02-L-D-NP-A-K-TR Applications
There are a lot of Samtec Inc. MEC1-130-02-L-D-NP-A-K-TR Edgeboard Connectors applications.
- Instrumentation and test equipment
- Wireless and wired broadband communications
- Automotive
- Scientific instruments
- Communication Systems
- Medical Imaging
- Multiplexed Data Acquisition Systems
- Smart antenna systems
- Rotary encoder
- Microcontrollers.
