MEC8-110-02-L-DV-A
| Parameters | |
|---|---|
| Plating Thickness | 10μin |
| Card Thickness | 0.062 1.57mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Contact Material | Phosphor Bronze |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Housing Material | Polymer |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~125°C |
| Packaging | Bulk |
| Series | MEC8 - DV |
| JESD-609 Code | e3 |
| Feature | Board Guide |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Connector Type | CARD EDGE CONNECTOR |
| Number of Positions | 20 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Subcategory | Headers and Edge Type Connectors |
| MIL Conformance | NO |
| DIN Conformance | NO |
| IEC Conformance | NO |
| Filter Feature | NO |
| Contact Type | Hairpin Bellows |
| Mixed Contacts | NO |
| Option | GENERAL PURPOSE |
| Pitch | 0.031 0.80mm |
| Total Number of Contacts | 20 |
| Orientation | Straight |
| Number of Conductors | ONE |
| Contact Finish | Gold |
| Reliability | COMMERCIAL |
| Number Of PCB Rows | 2 |
| PCB Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mOhm |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Insulation Resistance | 1000000000Ohm |
| Body/Shell Style | SOCKET |
| Max Voltage Rating (AC) | 265V |
| Durability | 100 Cycles |
| Contact Finish Thickness | 10.0μin 0.25μm |
MEC8-110-02-L-DV-A Overview
The material was packaged according to the specifications of Bulk.It is recommended that you mount the device with mounting type Surface Mount.Connecting the device uses the connector socket CARD EDGE CONNECTOR.Board Guide features are available on the device.It's the MEC8 - DV that tells you which series it is.
MEC8-110-02-L-DV-A Features
MEC8 - DV series
MEC8-110-02-L-DV-A Applications
There are a lot of Samtec Inc. MEC8-110-02-L-DV-A Edgeboard Connectors applications.
- In-building wireless telephony
- Digital beam-forming systems for ultrasound
- Industrial Process Control
- Audio/Video devices
- Instrumentation and test equipment
- Telecommunications
- High Speed Data Acquisition
- Medical Imaging
- Imaging Systems
- Automotive
