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MF1S7031XDUD/V1V

Mainstream Contactless Smart Card FFC Wafer


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MF1S7031XDUD/V1V
  • Package: Die
  • Datasheet: PDF
  • Stock: 449
  • Description: Mainstream Contactless Smart Card FFC Wafer(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case Die
Operating Temperature -25°C~70°C
Packaging Bulk
Published 2010
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) Not Applicable
Type RFID Transponder
Frequency 13.56MHz
Interface UART
Standards ISO 14443
RoHS Status ROHS3 Compliant
See Relate Datesheet

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