MICROSMD010F-2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 1210 (3225 Metric), Concave |
| Surface Mount | YES |
| Terminal Shape | ONE SURFACE |
| Operating Temperature | -40°C~85°C |
| Packaging | Cut Tape (CT) |
| Published | 2006 |
| Series | PolySwitch®, microSMD |
| Size / Dimension | 0.127Lx0.102W 3.22mmx2.58mm |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 2A (4 Weeks) |
| Number of Terminations | 2 |
| Type | Polymeric |
| Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Voltage - Rated | 30V |
| Additional Feature | MINIMUM RESISTANCE IS 2.1 OHMS |
| Packing Method | TR, 7 INCH |
| Current Rating | 10A |
| Approval Agency | CSA, TUV, UL |
| Operating Supply Voltage | 30V |
| Terminal Placement | DUAL ENDED |
| Hold Current | 100mA |
| Current - Hold (Ih) (Max) | 100mA |
| Thermistor Application | TEMPERATURE SENSING |
| Time to Trip | 1s |
| Resistance - Initial (Ri) (Min) | 2.1Ohm |
| Resistance - Post Trip (R1) (Max) | 15Ohm |
| Current - Trip (It) | 250mA |
| Trip Current | 250mA |
| Ambient Temperature Range High | 85°C |
| Height | 850μm |
| Thickness (Max) | 0.033 0.85mm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
