Parameters |
Factory Lead Time |
1 Week |
Surface Mount |
YES |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
1313 |
Terminal Finish |
Tin (Sn) |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.1V |
Terminal Pitch |
0.75mm |
Time@Peak Reflow Temperature-Max (s) |
40 |
JESD-30 Code |
S-PBGA-B1313 |
Operating Temperature (Max) |
125°C |
Operating Temperature (Min) |
-40°C |
Supply Voltage-Max (Vsup) |
1.15V |
Temperature Grade |
AUTOMOTIVE |
Supply Voltage-Min (Vsup) |
1.05V |
Clock Frequency |
24MHz |
Boundary Scan |
YES |
RAM (words) |
256000 |
Bus Compatibility |
CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB |
Height Seated (Max) |
2.52mm |
Length |
29mm |
Width |
29mm |
RoHS Status |
RoHS Compliant |
MIMX8QM6AVUFFAB Description
The I.MX 8 series consists of two processors: i.MX 8QuadMax and 8QuadPlus. This product introduction covers the i.MX 8QuadMax processor, which consists of eight cores (two ARM Cortex - A72, four ARM Cortex - A53 and two ARM Cortex - M4F), two 32-bit GPU subsystems, VPU with 4K H.265 support, and two failover ready display controllers. The processor supports a single 4K display (with multiple display output options, including MIPI-DSI, HDMI, EDP/DP, and LVDS) or multiple smaller displays. The memory interface that supports LPDDR4, 4-way SPI/ 8-way SPI (FlexSPI), eMMC 5.1, original NAND, SD 3.0 and PCIe 3.0 provides a wide range of flexibility. The ARM core and the high-performance TenSilica HiFi 4 DSP for audio pre-and post-processing and speech recognition support advanced multicore audio processing.
MIMX8QM6AVUFFAB Features
? Multicore architecture provides 4× Cortex-A53, 2× Cortex-A72 cores, and 2× Cortex-M4F cores
?Graphics Processing Unit (GPU)
?Video Processing Unit (VPU)
?Tensilica HiFi 4 DSP for pre- and post-processing
?Memory
?High Security