MK64FN1M0VDC12
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 121-XFBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Published | 2002 |
| Series | Kinetis K60 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 121 |
| ECCN Code | 3A991.A.2 |
| Terminal Finish | TIN SILVER COPPER |
| HTS Code | 8542.31.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 3.3V |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| JESD-30 Code | S-PBGA-B121 |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 1.71V |
| Oscillator Type | Internal |
| Number of I/O | 83 |
| Speed | 120MHz |
| RAM Size | 256K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.71V~3.6V |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Core Processor | ARM® Cortex®-M4 |
| Peripherals | DMA, I2S, LVD, POR, PWM, WDT |
| Clock Frequency | 50MHz |
| Program Memory Type | FLASH |
| Core Size | 32-Bit |
| Program Memory Size | 1MB 1M x 8 |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG |
| Data Converter | A/D 37x16b; D/A 2x12b |
| Has ADC | YES |
| DMA Channels | YES |
| PWM Channels | YES |
| DAC Channels | YES |
| RoHS Status | ROHS3 Compliant |
MK64FN1M0VDC12 MCU Description
In an ultra-small packaging, the MK64FN1M0VDC12 provides high memory density, low power consumption, and optimal integration. It has the same comprehensive enablement and scalability as the Kinetis family. In addition, the MCU offers a full-retention low-power mode of 6 a with a wake-up time of 5 s, a run current of 250 a/MHz when executing from Flash, and is cost-optimized with new USB crystal-less capability.
MK64FN1M0VDC12 MCU Features
Performance
? Up to 120 MHz ARM? Cortex?-M4 core with DSP
instructions and floating-point unit
Memories and memory interfaces
? Up to 1 MB program flash memory and 256 KB RAM
? upto 128 KB FlexNVM and 4 KB FlexRAM on devices
with FlexMemory
? FlexBus external bus interface
System peripherals
? Multiple low-power modes, low-leakage wake-up unit
? Memory protection unit with multi-master protection
? External watchdog monitor and software watchdog
? 16-channel DMA controller
Security and integrity modules
? Hardware CRC module
? Hardware random-number generator
? Hardware encryption supporting DES, 3DES, AES,
MD5, SHA-1, and SHA-256 algorithms
? 128-bit unique identification (ID) number per chip
Analog modules
? Two 12-bit DACs
? Voltage reference
? Two 16-bit SAR ADCs
? Three analog comparators (CMP)
Communication interfaces
? Three SPI modules
? I2S module
? Three I2C modules. Support for up to 1 Mbit/s
? Secure Digital Host Controller (SDHC)
? Controller Area Network (CAN) module
? Six UART modules
? USB full-/low-speed On-the-Go controller
? Ethernet controller with MII and RMII interface
Timers
? Two 2-channel FlexTimers (PWM/Quad decoder)
? Real-time clock
? programmable delay block
? Two 8-channel Flex-Timers (PWM/Motor control)
? IEEE 1588 timers
? 32-bit PITs and 16-bit low-power timers
Clocks
? 48 MHz Internal Reference Clock (IRC48M)
? PLL, FLL, and multiple internal oscillators
? 3 to 32 MHz and 32 kHz crystal oscillator
Operating Characteristics
? Temperature range (ambient): –40 to 105°C
? Flash write voltage range: 1.71 to 3.6 V
? Voltage range: 1.71 to 3.6 V
MK64FN1M0VDC12 MCU Applications
Avionics
Major Home Appliances
Defibrillator
Smart Power Socket and Light Switch
Motion Control and Robotics
Motor Drives
POS Terminal
Robotic Appliance
