Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | 144-LQFP |
Surface Mount | YES |
Operating Temperature | -40°C~105°C TA |
Packaging | Tray |
Published | 2011 |
Series | Kinetis K60 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 144 |
ECCN Code | 3A991.A.2 |
Terminal Finish | Matte Tin (Sn) |
HTS Code | 8542.31.00.01 |
Technology | CMOS |
Terminal Position | QUAD |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 3.3V |
Terminal Pitch | 0.5mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
JESD-30 Code | S-PQFP-G144 |
Supply Voltage-Max (Vsup) | 3.6V |
Supply Voltage-Min (Vsup) | 1.71V |
Oscillator Type | Internal |
Number of I/O | 100 |
Speed | 120MHz |
RAM Size | 192K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.71V~3.6V |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Core Processor | ARM® Cortex®-M4 |
Peripherals | DMA, I2S, LVD, POR, PWM, WDT |
Clock Frequency | 50MHz |
Program Memory Type | FLASH |
Core Size | 32-Bit |
Program Memory Size | 512KB 512K x 8 |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG |
Data Converter | A/D 41x16b; D/A 2x12b |
Has ADC | YES |
DMA Channels | YES |
PWM Channels | YES |
DAC Channels | YES |
EEPROM Size | 4K x 8 |
Length | 20mm |
Width | 20mm |
RoHS Status | ROHS3 Compliant |
K64 product family members are optimized for cost-sensitive applications that require low power consumption, USB/ Ethernet connectivity, and up to 256 KB embedded SRAM. These devices have the full support and scalability of the Kinetis series. The product provides: running power consumption as low as 250MHzA/ μ. The static power consumption is reduced to 5.80 μ A, full state holding and 5 μ wake-up. The lowest static mode is as low as 339 nA ·USB LS/FS OTG 2.0.It supports embedded 3.3V and 120mA LDO VREG, supports 10 Mbit/s 100 Mbit/s Ethernet MAC without crystal operation for USB devices, and supports MII and RMII interfaces.
Performance
? Up to 120 MHz ARM? Cortex?-M4 core with DSP
instructions and floating point unit
Memories and memory interfaces
? Up to 1 MB program flash memory and 256 KB RAM
? Upto 128 KB FlexNVM and 4 KB FlexRAM on devices
with FlexMemory
? FlexBus external bus interface
System peripherals
? Multiple low-power modes, low-leakage wake-up unit
? Memory protection unit with multi-master protection
? 16-channel DMA controller
? External watchdog monitor and software watchdog
Security and integrity modules
? Hardware CRC module
? Hardware random-number generator
? Hardware encryption supporting DES, 3DES, AES,
MD5, SHA-1, and SHA-256 algorithms
? 128-bit unique identification (ID) number per chip
Analog modules
? Two 16-bit SAR ADCs
? Two 12-bit DACs
? Three analog comparators (CMP)
? Voltage reference
System modules