Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | 256-LBGA |
Surface Mount | YES |
Operating Temperature | -40°C~105°C TA |
Packaging | Tray |
Published | 2011 |
Series | Kinetis K70 |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 256 |
ECCN Code | 3A991.A.2 |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Additional Feature | ALSO OPERATES AT 1 V MINIMUM SUPPLY |
HTS Code | 8542.31.00.01 |
Subcategory | Microcontrollers |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 3.3V |
Terminal Pitch | 1mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | MK70FN1M0 |
JESD-30 Code | S-PBGA-B256 |
Qualification Status | Not Qualified |
Supply Voltage-Max (Vsup) | 3.6V |
Power Supplies | 1.8/3.3V |
Supply Voltage-Min (Vsup) | 1.71V |
Oscillator Type | Internal |
Number of I/O | 128 |
Speed | 120MHz |
RAM Size | 128K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.71V~3.6V |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Core Processor | ARM® Cortex®-M4 |
Peripherals | DMA, I2S, LCD, LVD, POR, PWM, WDT |
Clock Frequency | 32MHz |
Program Memory Type | FLASH |
Core Size | 32-Bit |
Program Memory Size | 1MB 1M x 8 |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG |
Supply Current-Max | 177mA |
Bit Size | 32 |
Data Converter | A/D 71x16b; D/A 2x12b |
Has ADC | YES |
DMA Channels | YES |
PWM Channels | YES |
DAC Channels | YES |
ROM (words) | 1048576 |
CPU Family | CORTEX-M4F |
Height Seated (Max) | 1.7mm |
Length | 17mm |
Width | 17mm |
RoHS Status | ROHS3 Compliant |
The Kinetis K70 Series MCU MK70FN1M0VMJ12provides optimized low-power and mixed-signal analog integration for applications such as industrial control panels, navigation displays, point-of-sale terminals and medical monitoring devices.
? Operating Characteristics
– Voltage range: 1.71 to 3.6 V
– Flash write voltage range: 1.71 to 3.6 V
– Temperature range (ambient): -40 to 105°C
? Performance
– Up to 120 MHz Arm? Cortex?-M4 core with DSP
instructions delivering 1.25 Dhrystone MIPS per
MHz
? Memories and memory interfaces
– Up to 1024 KB program flash memory on nonFlexMemory devices
– Up to 512 KB program flash memory on
FlexMemory devices
– Up to 512 KB FlexNVM on FlexMemory devices
– 16 KB FlexRAM on FlexMemory devices
– Up to 128 KB RAM
– Serial programming interface (EzPort)
– FlexBus external bus interface
– DDR controller interface
– NAND flash controller interface
? Clocks
– 3 to 32 MHz crystal oscillator
– 32 kHz crystal oscillator
– Multi-purpose clock generator
? System peripherals
– Multiple low-power modes to provide power
optimization based on application requirements
– Memory protection unit with multi-master
protection
– 32-channel DMA controller, supporting up to 128
request sources
– External watchdog monitor
– Software watchdog
– Low-leakage wakeup unit
Heating Ventilation, and Air Conditioning (HVAC)
Network Security
3-Phase AC Induction Motor
Air Conditioning (AC)
Brushless DC Motor (BLDC) Control
Electricity Grid and Distribution
Electricity Meter
Energy Gateway
Gas Meter
Heat Metering