Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | 16-UFQFN Exposed Pad |
Surface Mount | YES |
Operating Temperature | -40°C~105°C TA |
Packaging | Tray |
Published | 2002 |
Series | Kinetis KL03 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 16 |
ECCN Code | 3A991.A.2 |
Terminal Finish | Matte Tin (Sn) |
HTS Code | 8542.31.00.01 |
Subcategory | Microcontrollers |
Technology | CMOS |
Terminal Position | QUAD |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 3.3V |
Terminal Pitch | 0.5mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
Base Part Number | MKL03Z32 |
JESD-30 Code | S-XQCC-N16 |
Qualification Status | Not Qualified |
Supply Voltage-Max (Vsup) | 3.6V |
Power Supplies | 1.8/3.3V |
Supply Voltage-Min (Vsup) | 1.71V |
Oscillator Type | Internal |
Number of I/O | 14 |
Speed | 48MHz |
RAM Size | 2K x 8 |
Voltage - Supply (Vcc/Vdd) | 1.71V~3.6V |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Core Processor | ARM® Cortex®-M0+ |
Peripherals | Brown-out Detect/Reset, LVD, POR, PWM, WDT |
Clock Frequency | 24MHz |
Program Memory Type | FLASH |
Core Size | 32-Bit |
Program Memory Size | 32KB 32K x 8 |
Connectivity | I2C, SPI, UART/USART |
Supply Current-Max | 6.82mA |
Bit Size | 32 |
Data Converter | A/D 7x12b |
Has ADC | YES |
DMA Channels | NO |
PWM Channels | YES |
DAC Channels | NO |
ROM (words) | 32768 |
CPU Family | CORTEX-M0 |
Length | 3mm |
Width | 3mm |
RoHS Status | ROHS3 Compliant |
Supports ultra-low power 48 KB devices with up to 32 MHz flash memory. The world's smallest MCU based on ARM technology. An ideal solution for the design of ultra-small, ultra-low-power edge nodes of the Internet of things. The product offers: miniature packages, including 1.6 x 2.0 mm2 WLCSP operating power consumption as low as 50 μ A / MHz static power consumption as low as 2.2 μ A, wake-up time of 7.5 microseconds for full hold, highly integrated peripherals in static mode as low as 77 nA during deep sleep, including new boot read-only memory and high-precision internal voltage reference.
Core
? ARM? Cortex?-M0+ core up to 48 MHz
Memories
? Up to 32 KB program flash memory
? 2 KB SRAM
? 8 KB ROM with build-in bootloader
? 16 bytes regfile
System peripherals
? Nine low-power modes to provide power optimization
based on application requirements
? COP Software watchdog
? Low-leakage wakeup unit
? SWD debug interface and Micro Trace Buffer
? Bit Manipulation Engine
Clocks
? 48 MHz high accuracy internal reference clock
? 8/2 MHz low power internal reference clock
? 32 kHz to 40 kHz crystal oscillator
? 1 kHz LPO clock
Operating Characteristics
? Voltage range: 1.71 to 3.6 V
? Flash write voltage range: 1.71 to 3.6 V
new boot read-only memory