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MM74HC126SJ

MM74HC126SJ datasheet pdf and Logic - Buffers, Drivers, Receivers, Transceivers product details from ON Semiconductor stock available at Noco


  • Manufacturer: ON Semiconductor
  • Nocochips NO: 598-MM74HC126SJ
  • Package: 14-SOIC (0.209, 5.30mm Width)
  • Datasheet: PDF
  • Stock: 233
  • Description: MM74HC126SJ datasheet pdf and Logic - Buffers, Drivers, Receivers, Transceivers product details from ON Semiconductor stock available at Noco(Kg)

Details

Tags

Parameters
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 14-SOIC (0.209, 5.30mm Width)
Number of Pins 14
Weight 218.3mg
Operating Temperature -40°C~85°C TA
Packaging Tube
Series 74HC
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Power Dissipation 500mW
Voltage - Supply 2V~6V
Base Part Number 74HC126
Output Type 3-State
Polarity Non-Inverting
Number of Channels 4
Propagation Delay 22 ns
Quiescent Current 8μA
Turn On Delay Time 175 ns
Logic Function Buffer, Inverting
Current - Output High, Low 7.8mA 7.8mA
Logic Type Buffer, Non-Inverting
Number of Bits per Element 1
RoHS Status RoHS Compliant
Lead Free Lead Free

MM74HC126SJ Overview


Logical driver uses a neat 14-SOIC (0.209, 5.30mm Width) package. Tube external packaging. Available in Surface Mount. Voltage buffer adopts Buffer, Non-Inverting logic prototype. Buffer IC is fed with a voltage of 2V~6V. Qualified to operate within -40°C~85°C TA. The high and low logic state output current of logical driver is 7.8mA 7.8mA. Logical driver can deal with 3-State output (s). Digital buffer is one of the 74HC series devices. Buffer IC is suitable for Surface Mount applications. Logical driver has 14 pins. The bus transceiver employs 1 bits for each element. You can search "74HC126" for other related electrical components. In quiescent state, the electronic part uses 8μA. 4 channels for high quality communication.

MM74HC126SJ Features



MM74HC126SJ Applications


There are a lot of ON Semiconductor MM74HC126SJ Buffers & Transceivers applications.

  • Precision geodetic measurement
  • Televisions
  • Broadcast application
  • Mainframes, workstations or storage devices
  • Fiber distributed data interface (FDDI)
  • Lamps
  • Cordless telephone
  • transmission relay
  • Wireless network systems
  • Laser diode bonding

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