Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
1998 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC823 |
Speed |
75MHz |
Core Processor |
PowerPC |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
I2C, SMC, SCC, SPI, UART |
Co-Processors/DSP |
Communications; RISC CPM |
Display & Interface Controllers |
LCD, Video |
RoHS Status |
Non-RoHS Compliant |
MPC823ZQ75B2T Overview
Packed in 256-BBGA, the microprocessor is convenient for shipping overseas. High reliability can be achieved by using the advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. The operating temperature around 0°C~95°C TA should be understood. MPC8xx is its series number. The CPU is powered by a PowerPC core. A total of DRAM RAM controllers are used by this CPU. This microprocessor features interfaces I2C, SMC, SCC, SPI, UART. In this CPU, I/O is set to 3.3V. MPC823 is a good way to search for variants of the microprocessor.
MPC823ZQ75B2T Features
PowerPC Core
MPC823ZQ75B2T Applications
There are a lot of NXP USA Inc. MPC823ZQ75B2T Microprocessor applications.
- Paper shredders
- Microwave ovens
- Embedded gateways
- Xbox
- Entertainment products
- Air fryers
- 3D printers
- Graphic terminals
- Copiers
- Calculators