MPC8313VRADDB
| Parameters | |
|---|---|
| Package / Case | 516-BBGA Exposed Pad |
| Supplier Device Package | 516-TEPBGA (27x27) |
| Operating Temperature | 0°C~105°C TA |
| Packaging | Tray |
| Series | MPC83xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Speed | 267MHz |
| Core Processor | PowerPC e300c3 |
| Voltage - I/O | 1.8V 2.5V 3.3V |
| Ethernet | 10/100/1000Mbps (2) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DDR, DDR2 |
| USB | USB 2.0 + PHY (1) |
| Additional Interfaces | DUART, HSSI, I2C, PCI, SPI |
| RoHS Status | ROHS3 Compliant |
MPC8313VRADDB Overview
Since the microprocessor is packed in 516-BBGA Exposed Pad, shipping overseas is convenient. High reliability can be achieved by using the advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Understand the operating temperature around 0°C~105°C TA. The MPC83xx series contains it. The CPU is cored with a PowerPC e300c3 processor. DDR, DDR2 RAM controllers are used by this CPU. Featuring DUART, HSSI, I2C, PCI, SPI interfaces, this microprocessor can better serve you. 1.8V 2.5V 3.3V is the CPU's I/O address. Suppliers offer the 516-TEPBGA (27x27) package.
MPC8313VRADDB Features
PowerPC e300c3 Core
MPC8313VRADDB Applications
There are a lot of Rochester Electronics, LLC MPC8313VRADDB Microprocessor applications.
- Day to day life field
- Automatic staplers
- Leakage current tester
- Microwave ovens
- Instrument control
- 8. Navigation control field
- Laminators
- Electrocardiogram (EKG)
- Measurement and control field
- Magnetic resonance imaging (MRI)
