MPC8313ZQADDB
| Parameters | |
|---|---|
| Package / Case | 516-BBGA Exposed Pad |
| Supplier Device Package | 516-TEPBGA (27x27) |
| Operating Temperature | 0°C~105°C TA |
| Packaging | Tray |
| Published | 2008 |
| Series | MPC83xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MPC8313 |
| Speed | 267MHz |
| Core Processor | PowerPC e300c3 |
| Voltage - I/O | 1.8V 2.5V 3.3V |
| Ethernet | 10/100/1000Mbps (2) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DDR, DDR2 |
| USB | USB 2.0 + PHY (1) |
| Additional Interfaces | DUART, HSSI, I2C, PCI, SPI |
| RoHS Status | Non-RoHS Compliant |
MPC8313ZQADDB Overview
The embedded microprocessor has been packed in 516-BBGA Exposed Pad for convenient overseas shipping. High reliability is provided by the advanced packaging method Tray. Cores/Bus width is 1 Core 32-Bit. The operating temperature around 0°C~105°C TA should be understood. In the MPC83xx series, it is found. A PowerPC e300c3 processor is present in this CPU. The CPU contains DDR, DDR2 RAM controllers. A DUART, HSSI, I2C, PCI, SPI interface has been added to this microprocessor in order to serve the user better. In this CPU, I/O is set to 1.8V 2.5V 3.3V. You can search for variants of a microprocessor with MPC8313. Suppliers offer the 516-TEPBGA (27x27) package.
MPC8313ZQADDB Features
PowerPC e300c3 Core
MPC8313ZQADDB Applications
There are a lot of NXP USA Inc. MPC8313ZQADDB Microprocessor applications.
- Microwave ovens
- Calculator
- Industrial control field
- Answering machines
- PDAs, game consoles
- Smart instruments
- Food and beverage
- Instrumentation and process control field
- Industrial instrumentation devices
- Scanners
