Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC850 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
MPC850DEVR66BU Overview
Packed in 256-BBGA, the microprocessor is convenient for shipping overseas. Using advanced packaging techniques Tray, high reliability is ensured. There are 1 Core 32-Bit cores/bus width on the CPU. Identify the operating temperature around 0°C~95°C TA. MPC8xx is its series number. A CPU with this architecture uses DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to better serve its users. I/O is run at 3.3V on this CPU. Use MPC850 when searching for variants of the embedded microprocessor.
MPC850DEVR66BU Features
MPC850DEVR66BU Applications
There are a lot of NXP USA Inc. MPC850DEVR66BU Microprocessor applications.
- Electronic jamming systems
- Microwave ovens
- Smartphones-calling, video calling, texting, email
- Copiers
- Smoke alarms
- Instrument control
- Fax machines
- Robots
- Electrocardiogram (EKG)
- Robotic prosthetic limbs