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MPC850DEVR66BU

Microprocessor MPC8xx Series MPC850 256-BBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MPC850DEVR66BU
  • Package: 256-BBGA
  • Datasheet: PDF
  • Stock: 252
  • Description: Microprocessor MPC8xx Series MPC850 256-BBGA (Kg)

Details

Tags

Parameters
Package / Case 256-BBGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status ROHS3 Compliant

MPC850DEVR66BU Overview


Packed in 256-BBGA, the microprocessor is convenient for shipping overseas. Using advanced packaging techniques Tray, high reliability is ensured. There are 1 Core 32-Bit cores/bus width on the CPU. Identify the operating temperature around 0°C~95°C TA. MPC8xx is its series number. A CPU with this architecture uses DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to better serve its users. I/O is run at 3.3V on this CPU. Use MPC850 when searching for variants of the embedded microprocessor.

MPC850DEVR66BU Features



MPC850DEVR66BU Applications


There are a lot of NXP USA Inc. MPC850DEVR66BU Microprocessor applications.

  • Electronic jamming systems
  • Microwave ovens
  • Smartphones-calling, video calling, texting, email
  • Copiers
  • Smoke alarms
  • Instrument control
  • Fax machines
  • Robots
  • Electrocardiogram (EKG)
  • Robotic prosthetic limbs

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