Parameters |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
Package / Case |
256-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
MPC850SRCZQ50BU Overview
With a packing size of 256-BBGA, this embedded microprocessor is ideal for international shipping. The packaging method Tray provides high reliability. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. Identify the operating temperature around -40°C~95°C TA. This is part of the MPC8xx series. The CPU contains DRAM RAM controllers. This microprocessor has HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to serve you better. The CPU runs at 3.3V when it comes to I/O. Search MPC850 for variants of the embedded microprocessor.
MPC850SRCZQ50BU Features
MPC850SRCZQ50BU Applications
There are a lot of NXP USA Inc. MPC850SRCZQ50BU Microprocessor applications.
- Vacuum cleaners
- Smart instruments
- Network application field
- Industrial instrumentation devices
- Computer/laptop
- Oscilloscopes
- Industrial control field
- Smoke alarms
- Electronic jamming systems
- Digital set-top boxes