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MPC850SRZQ66BU

Microprocessor MPC8xx Series MPC850 256-BBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MPC850SRZQ66BU
  • Package: 256-BBGA
  • Datasheet: PDF
  • Stock: 777
  • Description: Microprocessor MPC8xx Series MPC850 256-BBGA (Kg)

Details

Tags

Parameters
Package / Case 256-BBGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

MPC850SRZQ66BU Overview


With a packing size of 256-BBGA, this embedded microprocessor is ideal for international shipping. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width of the CPU is 1 Core 32-Bit . Obtain a basic understanding of operating temperature around 0°C. In the MPC8xx series, it is found. It has DRAM RAM controllers. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces. 3.3V is the CPU's I/O address. If you are looking for variants of the cpu microprocessor, try search with MPC850.

MPC850SRZQ66BU Features



MPC850SRZQ66BU Applications


There are a lot of NXP USA Inc. MPC850SRZQ66BU Microprocessor applications.

  • Torpedo guidance
  • Electronic jamming systems
  • Gas monitoring systems
  • Digital cameras
  • Mobile computers
  • DCS control intelligent sensor
  • Information appliances (networking of household appliances)
  • Printers
  • 3D printers
  • Robotic prosthetic limbs

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