Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC850 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MPC850SRZQ66BU Overview
With a packing size of 256-BBGA, this embedded microprocessor is ideal for international shipping. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width of the CPU is 1 Core 32-Bit . Obtain a basic understanding of operating temperature around 0°C. In the MPC8xx series, it is found. It has DRAM RAM controllers. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces. 3.3V is the CPU's I/O address. If you are looking for variants of the cpu microprocessor, try search with MPC850.
MPC850SRZQ66BU Features
MPC850SRZQ66BU Applications
There are a lot of NXP USA Inc. MPC850SRZQ66BU Microprocessor applications.
- Torpedo guidance
- Electronic jamming systems
- Gas monitoring systems
- Digital cameras
- Mobile computers
- DCS control intelligent sensor
- Information appliances (networking of household appliances)
- Printers
- 3D printers
- Robotic prosthetic limbs