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MPC850ZQ66BU

Microprocessor MPC8xx Series MPC850 256-BBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MPC850ZQ66BU
  • Package: 256-BBGA
  • Datasheet: PDF
  • Stock: 117
  • Description: Microprocessor MPC8xx Series MPC850 256-BBGA (Kg)

Details

Tags

Parameters
Package / Case 256-BBGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number MPC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

MPC850ZQ66BU Overview


The microprocessor is convenient for international shipping since it is packaged in 256-BBGA. High reliability can be achieved by using the advanced packaging method Tray. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. The operating temperature around 0°C~95°C TA should be understood. From the MPC8xx series. Memory controllers for this CPU are DRAM. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces. At 3.3V, the CPU runs its I/O. Try searching for variants of the cpu microprocessor with MPC850.

MPC850ZQ66BU Features



MPC850ZQ66BU Applications


There are a lot of NXP USA Inc. MPC850ZQ66BU Microprocessor applications.

  • Smoke alarms
  • Fabric
  • Playstation
  • Guidance-GPS
  • Food and beverage
  • Hard drives
  • Computed Tomography (CT scan)
  • Robotic prosthetic limbs
  • 8. Navigation control field
  • Missile control

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