Parameters |
Package / Case |
783-BBGA, FCBGA |
Supplier Device Package |
783-FCPBGA (29x29) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2006 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8535 |
Speed |
600MHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
1.8V 2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2, DDR3 |
USB |
USB 2.0 (2) |
Additional Interfaces |
DUART, I2C, MMC/SD, PCI, SPI |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MPC8535BVTAKG Overview
With a packing size of 783-BBGA, FCBGA, this embedded microprocessor is ideal for international shipping. In order to provide high reliability, advanced packaging method Tray is used. There are 1 Core 32-Bit cores per bus width on the CPU. The operating temperature around 0°C~105°C TA should be understood. This is a member of the MPC85xx series. A PowerPC e500 processor is present in this CPU. A CPU with this architecture uses DDR2, DDR3 RAM controllers. Featuring DUART, I2C, MMC/SD, PCI, SPI interfaces, this microprocessor can better serve you. 1.8V 2.5V 3.3V is the I/O speed of this CPU. The microprocessor can be searched for with MPC8535 if you are looking for variants. A supplier offers a 783-FCPBGA (29x29) package.
MPC8535BVTAKG Features
PowerPC e500 Core
MPC8535BVTAKG Applications
There are a lot of NXP USA Inc. MPC8535BVTAKG Microprocessor applications.
- Temperature sensing and controlling devices
- X-ray
- Projectors
- Network communication, mobile communication field
- Robotic prosthetic limbs
- Virtual reality VR robots
- Leakage current tester
- Office automation equipment and computer peripherals
- Glucose monitoring systems (for Type 1 Diabetes)
- Multi-meter