Parameters |
Package / Case |
783-BBGA, FCBGA |
Supplier Device Package |
783-FCPBGA (29x29) |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Published |
2006 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8535 |
Speed |
800MHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
1.8V 2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2, DDR3 |
USB |
USB 2.0 (2) |
Additional Interfaces |
DUART, I2C, MMC/SD, PCI, SPI |
Co-Processors/DSP |
Security; SEC |
Security Features |
Cryptography |
SATA |
SATA 3Gbps (1) |
RoHS Status |
ROHS3 Compliant |
MPC8535ECVTANGA Overview
With a packing size of 783-BBGA, FCBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved using advanced packaging method Tray. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. Recognize operating temperatures around -40°C~105°C TA. MPC85xx is its series number. PowerPC e500 is the processor core of this CPU. A CPU with this architecture uses DDR2, DDR3 RAM controllers. A DUART, I2C, MMC/SD, PCI, SPI interface has been added to this microprocessor in order to serve the user better. In this CPU, I/O is set to 1.8V 2.5V 3.3V. Search MPC8535 for variants of the embedded microprocessor. Suppliers are offering 783-FCPBGA (29x29) packages.
MPC8535ECVTANGA Features
PowerPC e500 Core
MPC8535ECVTANGA Applications
There are a lot of NXP USA Inc. MPC8535ECVTANGA Microprocessor applications.
- Electronic jamming systems
- 3D printers
- Consumer electronics products
- Electromechanical control
- Automatic staplers
- Automatic control
- Smart instruments
- Dialysis machines (performs function of liver)
- Smart highways (navigation, traffic control, information monitoring and car service)
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)