Parameters |
Package / Case |
783-BBGA, FCBGA |
Supplier Device Package |
783-FCPBGA (29x29) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
1.5GHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
1.8V 2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2, DDR3 |
USB |
USB 2.0 (3) |
Additional Interfaces |
DUART, I2C, MMC/SD, PCI, SPI |
Co-Processors/DSP |
Security; SEC |
Security Features |
Cryptography |
SATA |
SATA 3Gbps (2) |
RoHS Status |
ROHS3 Compliant |
MPC8536EBVTAVLA Overview
With a packing size of 783-BBGA, FCBGA, this embedded microprocessor is ideal for international shipping. Using advanced packaging techniques Tray, high reliability is ensured. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. Extended operating temperature around 0°C~105°C TA. This is a member of the MPC85xx series. A PowerPC e500 processor is present in this CPU. This CPU uses DDR2, DDR3 RAM controllers. With its DUART, I2C, MMC/SD, PCI, SPI interfaces, this microprocessor will be able to serve you better. In this CPU, I/O is set to 1.8V 2.5V 3.3V. A supplier offers a 783-FCPBGA (29x29) package.
MPC8536EBVTAVLA Features
PowerPC e500 Core
MPC8536EBVTAVLA Applications
There are a lot of Rochester Electronics, LLC MPC8536EBVTAVLA Microprocessor applications.
- X-ray
- Digital cameras
- Hard drives
- Automatic control
- Automatic staplers
- Computed Tomography (CT scan)
- Fire alarms
- Day to day life field
- Missile control
- Auto-breaking system