Parameters |
Package / Case |
783-BBGA, FCBGA |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2007 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8545 |
Speed |
800MHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
1.8V 2.5V 3.3V |
Ethernet |
10/100/1000Mbps (4) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, DDR2, SDRAM |
Additional Interfaces |
DUART, I2C, PCI, RapidIO |
Co-Processors/DSP |
Signal Processing; SPE, Security; SEC |
Security Features |
Cryptography, Random Number Generator |
RoHS Status |
Non-RoHS Compliant |
MPC8545EPXANGD Overview
With a packing size of 783-BBGA, FCBGA, this embedded microprocessor is ideal for international shipping. A high level of reliability is provided by using an advanced packaging method Tray. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Extended operating temperature around 0°C~105°C TA. This is part of the MPC85xx series. The CPU is powered by a PowerPC e500 core. It has DDR, DDR2, SDRAM RAM controllers. With its DUART, I2C, PCI, RapidIO interfaces, this microprocessor will be able to serve you better. The CPU runs at 1.8V 2.5V 3.3V when it comes to I/O. Search MPC8545 for variants of the embedded microprocessor.
MPC8545EPXANGD Features
PowerPC e500 Core
MPC8545EPXANGD Applications
There are a lot of NXP USA Inc. MPC8545EPXANGD Microprocessor applications.
- Smartphone
- Light sensing & controlling devices
- Fire detection & safety devices
- Communication-bluetooth, Wi-Fi, radio
- Day to day life field
- Heater/Fan
- Office automation equipment and computer peripherals
- Mobile computers
- Dryers
- Xbox