Parameters |
Package / Case |
783-BBGA, FCBGA |
Supplier Device Package |
783-FCPBGA (29x29) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8555 |
Speed |
1.0GHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, SDRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
DUART, I2C, PCI, SPI, TDM, UART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MPC8555PXAQF Overview
The embedded microprocessor ships overseas conveniently packed in 783-BBGA, FCBGA. Using advanced packaging techniques Tray, high reliability is ensured. There are 1 Core 32-Bit cores per bus width on the CPU. K0°C~105°C TAw what the operating temperature is around 0°C~105°C TA. In the MPC85xx series, it is found. A PowerPC e500 processor is present in this CPU. Memory controllers for this CPU are DDR, SDRAM. The microprocessor features interfaces DUART, I2C, PCI, SPI, TDM, UART for better service. As far as I/O is concerned, this CPU runs at 2.5V 3.3V. You can search for variants of a microprocessor with MPC8555. Suppliers offer a 783-FCPBGA (29x29) package.
MPC8555PXAQF Features
PowerPC e500 Core
MPC8555PXAQF Applications
There are a lot of NXP USA Inc. MPC8555PXAQF Microprocessor applications.
- DCS control intelligent sensor
- Robotic prosthetic limbs
- Digital TVs
- Microwave ovens
- Leakage current tester
- Industrial instrumentation devices
- 8. Navigation control field
- Copiers
- Computed Tomography (CT scan)
- Removable disks