Parameters |
Package / Case |
357-BBGA |
Supplier Device Package |
357-PBGA (25x25) |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
50MHz |
Core Processor |
MPC8xx |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MPC855TZQ50D4 Overview
Packed in 357-BBGA, the microprocessor is convenient for shipping overseas. High reliability is achieved by using advanced packaging methods Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Recognize operating temperatures around 0°C~95°C TA. From the MPC8xx series. The CPU is cored by a processor with a number of 0 cores. A CPU with this architecture uses DRAM RAM controllers. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces. In this CPU, I/O is set to 3.3V. Suppliers offer the 357-PBGA (25x25) package.
MPC855TZQ50D4 Features
MPC8xx Core
MPC855TZQ50D4 Applications
There are a lot of Rochester Electronics, LLC MPC855TZQ50D4 Microprocessor applications.
- Switches
- Broadband technology, video and voice processing
- Light sensing & controlling devices
- Routers
- Leakage current tester
- Data acquisition and control
- Measurement and control field
- 8. Navigation control field
- Volt meter
- Answering machines