Parameters |
Package / Case |
784-BBGA, FCBGA |
Supplier Device Package |
783-FCPBGA (29x29) |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
667MHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, SDRAM |
Additional Interfaces |
I2C, PCI, RapidIO, SPI, TDM, UART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MPC8560PX667LC Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 784-BBGA, FCBGA. The packaging method Tray provides high reliability. Cores/Bus width is 1 Core 32-Bit. The operating temperature around 0°C~105°C TA should be understood. MPC85xx is its series number. The CPU is powered by a PowerPC e500 core. There are DDR, SDRAM RAM controllers on this CPU. With its I2C, PCI, RapidIO, SPI, TDM, UART interfaces, this microprocessor will be able to serve you better. 2.5V 3.3V is the CPU's I/O address. 783-FCPBGA (29x29) package is offered by suppliers.
MPC8560PX667LC Features
PowerPC e500 Core
MPC8560PX667LC Applications
There are a lot of Rochester Electronics, LLC MPC8560PX667LC Microprocessor applications.
- Industrial instrumentation devices
- Scanners
- 3D printers
- Oil and gas
- Toasters
- Network communication, mobile communication field
- ECG machine
- Projectors
- Washing machine
- Network application field