Parameters |
Package / Case |
784-BBGA, FCBGA |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2002 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8560 |
Speed |
833MHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, SDRAM |
Additional Interfaces |
I2C, PCI, RapidIO, SPI, TDM, UART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MPC8560PX833LB Overview
Since the microprocessor is packed in 784-BBGA, FCBGA, shipping overseas is convenient. A high level of reliability is provided by using an advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Be aware of the operating temperature around 0°C~105°C TA. It comes from the MPC85xx series. PowerPC e500 processors are embedded in this CPU. Memory controllers for this CPU are DDR, SDRAM. The microprocessor features interfaces I2C, PCI, RapidIO, SPI, TDM, UART for better service. As far as I/O is concerned, this CPU runs at 2.5V 3.3V. Search MPC8560 for variants of the embedded microprocessor.
MPC8560PX833LB Features
PowerPC e500 Core
MPC8560PX833LB Applications
There are a lot of NXP USA Inc. MPC8560PX833LB Microprocessor applications.
- Safety -airbags, automatic braking system (ABS)
- Graphic terminals
- Missile control
- Air fryers
- Office automation equipment and computer peripherals
- Traditional industrial transformation
- Speed meter
- Electromechanical control
- Laminators
- Switches