Parameters |
Package / Case |
784-BBGA, FCBGA |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2002 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8560 |
Speed |
667MHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
2.5V 3.3V |
Ethernet |
10/100/1000Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR, SDRAM |
Additional Interfaces |
I2C, PCI, RapidIO, SPI, TDM, UART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
MPC8560VT667LB Overview
The embedded microprocessor has been packed in 784-BBGA, FCBGA for convenient overseas shipping. High reliability is provided by the advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Identify the operating temperature around 0°C~105°C TA. MPC85xx is its series number. Core-wise, this CPU has a PowerPC e500 processor. There are DDR, SDRAM RAM controllers on this CPU. This microprocessor features interfaces I2C, PCI, RapidIO, SPI, TDM, UART. 2.5V 3.3V is the CPU's I/O address. If you are looking for variants of the cpu microprocessor, try search with MPC8560.
MPC8560VT667LB Features
PowerPC e500 Core
MPC8560VT667LB Applications
There are a lot of NXP USA Inc. MPC8560VT667LB Microprocessor applications.
- Removable disks
- Traditional industrial transformation
- DDC control
- Heater/Fan
- Gas monitoring systems
- Projectors
- Broadband technology, video and voice processing
- Dryers
- Instrumentation and process control field
- Light sensing & controlling devices