Parameters |
Package / Case |
783-BBGA, FCBGA |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8569 |
Speed |
800MHz |
Core Processor |
PowerPC e500v2 |
Voltage - I/O |
1.0V 1.5V 1.8V 2.5V 3.3V |
Ethernet |
10/100Mbps (8), 1Gbps (4) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2, DDR3, SDRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART |
Co-Processors/DSP |
Communications; QUICC Engine, Security; SEC |
Security Features |
Cryptography, Random Number Generator |
RoHS Status |
ROHS3 Compliant |
MPC8569ECVTANKGB Overview
With a packing size of 783-BBGA, FCBGA, this embedded microprocessor is ideal for international shipping. In order to provide high reliability, advanced packaging method Tray is used. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. The operating temperature around -40°C~105°C TA should be understood. A MPC85xx series item. PowerPC e500v2 processors are embedded in this CPU. There are DDR2, DDR3, SDRAM RAM controllers on this CPU. This microprocessor features DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART interfaces to better serve its users. In this CPU, I/O is set to 1.0V 1.5V 1.8V 2.5V 3.3V. The microprocessor can be searched for with MPC8569 if you are looking for variants.
MPC8569ECVTANKGB Features
PowerPC e500v2 Core
MPC8569ECVTANKGB Applications
There are a lot of NXP USA Inc. MPC8569ECVTANKGB Microprocessor applications.
- Smartphone
- DCS control intelligent sensor
- Digital set-top boxes
- Data acquisition and control
- Graphic terminals
- Television
- Volt meter
- Network application field
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
- Torpedo guidance