Parameters |
Package / Case |
1023-BFBGA, FCBGA |
Operating Temperature |
0°C~105°C TA |
Packaging |
Tray |
Published |
2008 |
Series |
MPC85xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC8572 |
Speed |
1.2GHz |
Core Processor |
PowerPC e500 |
Voltage - I/O |
1.5V 1.8V 2.5V 3.3V |
Ethernet |
10/100/1000Mbps (4) |
Number of Cores/Bus Width |
2 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2, DDR3 |
Additional Interfaces |
DUART, HSSI, I2C, RapidIO |
Co-Processors/DSP |
Signal Processing; SPE, Security; SEC |
Security Features |
Cryptography, Random Number Generator |
RoHS Status |
ROHS3 Compliant |
MPC8572ELPXATLD Overview
With a packing size of 1023-BFBGA, FCBGA, this embedded microprocessor is ideal for international shipping. Using advanced packaging techniques Tray, high reliability is ensured. 2 Core 32-Bit cores/Bus width are present in the CPU. Obtain a basic understanding of operating temperature around 0°C. This is a member of the MPC85xx series. A PowerPC e500 processor is present in this CPU. There are DDR2, DDR3 RAM controllers used by this CPU. This microprocessor features DUART, HSSI, I2C, RapidIO interfaces to better serve its users. The CPU runs I/O at 1.5V 1.8V 2.5V 3.3V. If you are looking for variants of the cpu microprocessor, try search with MPC8572.
MPC8572ELPXATLD Features
PowerPC e500 Core
MPC8572ELPXATLD Applications
There are a lot of NXP USA Inc. MPC8572ELPXATLD Microprocessor applications.
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
- Automatic control
- Mobile computers
- Xbox
- Projectors
- Smartphone
- Magnetic resonance imaging (MRI)
- Playstation
- Toasters
- Computed Tomography (CT scan)