Parameters |
Package / Case |
357-BBGA |
Supplier Device Package |
357-PBGA (25x25) |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
133MHz |
Core Processor |
MPC8xx |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MPC859TZP133A Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. High reliability can be achieved by using the advanced packaging method Tray. The CPU has 1 Core 32-Bit cores/Bus width. It is important to understand the operating temperature around 0°C~95°C TA. In the series MPC8xx, it is found. Core-wise, this CPU has a MPC8xx processor. A total of DRAM RAM controllers are used by this CPU. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to better serve its users. 3.3V is the CPU's I/O address. Suppliers offer the package 357-PBGA (25x25).
MPC859TZP133A Features
MPC8xx Core
MPC859TZP133A Applications
There are a lot of Rochester Electronics, LLC MPC859TZP133A Microprocessor applications.
- Agriculture, transportation field
- Christmas lights
- Dishwashers
- Light sensing & controlling devices
- Walkie talkies
- Digital cameras
- Fabric
- Radio
- PDAs, game consoles
- Consumer electronics products