MPC860DECZQ66D4
| Parameters | |
|---|---|
| Package / Case | 357-BBGA |
| Operating Temperature | -40°C~95°C TA |
| Packaging | Tray |
| Published | 2004 |
| Series | MPC8xx |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | MPC860 |
| Speed | 66MHz |
| Voltage - I/O | 3.3V |
| Ethernet | 10Mbps (2) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RAM Controllers | DRAM |
| Additional Interfaces | I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
| Co-Processors/DSP | Communications; CPM |
| RoHS Status | Non-RoHS Compliant |
MPC860DECZQ66D4 Overview
With a packing size of 357-BBGA, this embedded microprocessor is ideal for international shipping. Advanced packaging method Tray is used to provide high reliability. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. K-40°C~95°C TAw what the operating temperature is around -40°C~95°C TA. The MPC8xx series contains it. The CPU uses DRAM RAM controllers. This microprocessor features interfaces I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. In this CPU, I/O is set to 3.3V. You can search for variants of a microprocessor with MPC860.
MPC860DECZQ66D4 Features
MPC860DECZQ66D4 Applications
There are a lot of NXP USA Inc. MPC860DECZQ66D4 Microprocessor applications.
- Petrochemical
- Home video and audio
- Virtual reality VR robots
- Kindle
- Electronic jamming systems
- Removable disks
- Toasters
- Instrumentation and process control field
- Information appliances (networking of household appliances)
- Multi-meter
