Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (2), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
MPC860DPCVR66D4 Overview
With a packing size of 357-BBGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Understand the operating temperature around -40°C~95°C TA. The MPC8xx series contains it. The CPU contains DRAM RAM controllers. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces. I/O is run at 3.3V on this CPU. The microprocessor can be searched for with MPC860 if you are looking for variants.
MPC860DPCVR66D4 Features
MPC860DPCVR66D4 Applications
There are a lot of NXP USA Inc. MPC860DPCVR66D4 Microprocessor applications.
- Pacemakers (used to control abnormal heart rhythm)
- Computed Tomography (CT scan)
- Radio
- Temperature sensing and controlling devices
- Playstation
- Automatic staplers
- Wastewater treatment
- Equipment control
- Hard drives
- Industrial control field