Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
80MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (2), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
MPC860DTVR80D4 Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 357-BBGA. High reliability is achieved with advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Extended operating temperature around 0°C~95°C TA. From the MPC8xx series. The CPU uses DRAM RAM controllers. A HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interface has been added to this microprocessor in order to serve the user better. In this CPU, I/O is set to 3.3V. The microprocessor can be searched for with MPC860 if you are looking for variants.
MPC860DTVR80D4 Features
MPC860DTVR80D4 Applications
There are a lot of NXP USA Inc. MPC860DTVR80D4 Microprocessor applications.
- Electromechanical control
- 3D printers
- Smart highways (navigation, traffic control, information monitoring and car service)
- Agriculture, transportation field
- Virtual reality VR robots
- Scanners
- Glucose monitoring systems (for Type 1 Diabetes)
- PDAs, game consoles
- Graphic terminals
- Fire alarms