Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tape & Reel (TR) |
Published |
1998 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
MPC860PVR66D4R2 Overview
The embedded microprocessor ships overseas conveniently packed in 357-BBGA. High reliability is achieved by using advanced packaging methods Tape & Reel (TR). In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. Identify the operating temperature around 0°C~95°C TA. This is a member of the MPC8xx series. This CPU uses DRAM RAM controllers. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. In this CPU, I/O is set to 3.3V. To find variants of the microprocessor, try searching with MPC860.
MPC860PVR66D4R2 Features
MPC860PVR66D4R2 Applications
There are a lot of NXP USA Inc. MPC860PVR66D4R2 Microprocessor applications.
- 3D printers
- Set-top boxes
- Calculator
- Digital TVs
- Embedded gateways
- Kindle
- Binding machines
- Toasters
- Network application field
- Ipad