Parameters |
Package / Case |
357-BBGA |
Supplier Device Package |
357-PBGA (25x25) |
Operating Temperature |
-40°C~115°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC862 |
Speed |
66MHz |
Core Processor |
MPC8xx |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MPC862TCZQ66B Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 357-BBGA. High reliability is provided by the advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~115°C TA. The MPC8xx series contains it. This CPU is cored with a MPC8xx processor. There are DRAM RAM controllers on this CPU. Featuring HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces, this microprocessor can better serve you. At 3.3V, the CPU runs its I/O. Use MPC862 when searching for variants of the embedded microprocessor. Suppliers are offering 357-PBGA (25x25) packages.
MPC862TCZQ66B Features
MPC8xx Core
MPC862TCZQ66B Applications
There are a lot of NXP USA Inc. MPC862TCZQ66B Microprocessor applications.
- Industrial control field
- Computer/laptop
- Electromechanical control
- Digital cameras
- Hearing aids
- Air fryers
- Gas monitoring systems
- Smart instruments
- Telephone sets
- Fire detection & safety devices