MSC8101M1375F
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 332-BFBGA, FCBGA |
| Operating Temperature | -40°C~105°C TJ |
| Packaging | Tray |
| Published | 2004 |
| Series | StarCore |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | SC140 Core |
| Base Part Number | MSC8101 |
| Interface | Communications Processor Module (CPM) |
| Voltage - I/O | 3.30V |
| Non-Volatile Memory | External |
| Voltage - Core | 1.60V |
| On Chip Data RAM | 512kB |
| Clock Rate | 275MHz |
| RoHS Status | Non-RoHS Compliant |
MSC8101M1375F Overview
This is an electronic component with a 332-BFBGA, FCBGA package.There is a packaging method of Tray provided with it.SC140 Core's wide range of applications makes it ideal for a wide variety of applications.The mounting is carried out in the direction of Surface Mount.It is essential that -40°C~105°C TJ is kept at a temperature that ensures proper operation of the machine.This refers to the analog voltage range that can be input or output from 3.30V.This digital signal processor is part of the StarCore series.The base part number MSC8101 can be used to identify many associated parts.
MSC8101M1375F Features
Supplied in the 332-BFBGA, FCBGA package
MSC8101M1375F Applications
There are a lot of NXP USA Inc. MSC8101M1375F DSP applications.
- Fourier transform
- Seismology
- Encoding/broadcast
- Computer vision technology
- MP3 audio player
- Telephone conversations
- Geoscience signal processing
- Financial signals
- Automobiles
- Biomedical engineering
