MSC8103M1100F
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 332-BFBGA, FCBGA |
| Operating Temperature | -40°C~105°C TJ |
| Packaging | Tray |
| Published | 2004 |
| Series | StarCore |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | SC140 Core |
| Base Part Number | MSC8103 |
| Interface | Communications Processor Module (CPM) |
| Voltage - I/O | 3.30V |
| Non-Volatile Memory | External |
| Voltage - Core | 1.60V |
| On Chip Data RAM | 512kB |
| Clock Rate | 275MHz |
| RoHS Status | Non-RoHS Compliant |
MSC8103M1100F Overview
It is a kind of electronic component available in the 332-BFBGA, FCBGA package.Tray is the packaging method provided.Due to its membership in SC140 Core, it is ideally suited for a wide range of uses.Surface Mount is the direction in which it is mounted.As long as it is operated at the temperature of -40°C~105°C TJ, it will operate normally.3.30V refers to the range of analog voltages that can be input or output.It is a part of the StarCore series of digital signal processors.The base part number MSC8103 can be used to identify many associated parts.
MSC8103M1100F Features
Supplied in the 332-BFBGA, FCBGA package
MSC8103M1100F Applications
There are a lot of NXP USA Inc. MSC8103M1100F DSP applications.
- Digital communications
- Radar
- MP3 audio player
- Audio compression
- Biometrics
- House construction
- Dam design
- Speech processing and recognition
- Infinite impulse response filters
- Vehicle electronics
