MSC8103VT1100F
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 332-BFBGA, FCBGA |
| Operating Temperature | -40°C~105°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | StarCore |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | SC140 Core |
| Reach Compliance Code | unknown |
| Base Part Number | MSC8103 |
| Interface | Communications Processor Module (CPM) |
| Voltage - I/O | 3.30V |
| Non-Volatile Memory | External |
| Voltage - Core | 1.60V |
| On Chip Data RAM | 512kB |
| Clock Rate | 275MHz |
| RoHS Status | ROHS3 Compliant |
MSC8103VT1100F Overview
In electronic terms, it is a type of component that comes in the package of type 332-BFBGA, FCBGA .The packaging way is Tray.With its association with SC140 Core, it is suitable for a wide range of applications.The device is attached in a way that faces Surface Mount.If it is operating at the temperature of -40°C~105°C TJ, then it will be operating normally.This refers to the analog voltage range that can be input or output from 3.30V.The StarCore series contains this digital signal processor.The base part number MSC8103 can be used to identify many associated parts.
MSC8103VT1100F Features
Supplied in the 332-BFBGA, FCBGA package
MSC8103VT1100F Applications
There are a lot of NXP USA Inc. MSC8103VT1100F DSP applications.
- Monitoring equipment
- Electronic information engineering
- Image signal processing
- Smart camera
- Fourier transform
- Voice recognition
- Tomography technology
- Digital camera
- Digital communications
- Scene analysis technology
