MSC8103VT1200F
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 332-BFBGA, FCBGA |
| Operating Temperature | -40°C~75°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | StarCore |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | SC140 Core |
| Reach Compliance Code | unknown |
| Base Part Number | MSC8103 |
| Interface | Communications Processor Module (CPM) |
| Voltage - I/O | 3.30V |
| Non-Volatile Memory | External |
| Voltage - Core | 1.60V |
| On Chip Data RAM | 512kB |
| Clock Rate | 300MHz |
| RoHS Status | ROHS3 Compliant |
MSC8103VT1200F Overview
In the 332-BFBGA, FCBGA package, it is a type of electronic component.Tray is the packaging method provided.In addition to meeting a wide range of requirements, it is a member of SC140 Core.It is mounted in the way of Surface Mount.As long as it is operated at the temperature of -40°C~75°C TJ, it will operate normally.The analog voltage range of 3.30V refers to the voltage that can be input or ouput.The StarCore series contains this digital signal processor.It is possible to identify numerous related parts using the base part number MSC8103.
MSC8103VT1200F Features
Supplied in the 332-BFBGA, FCBGA package
MSC8103VT1200F Applications
There are a lot of NXP USA Inc. MSC8103VT1200F DSP applications.
- Instrument modeling
- Computer vision technology
- Audio compression
- Computers and laptop
- Infinite impulse response filters
- Seismology
- Processing system
- Infrared
- Speech processing
- Scene analysis technology
