MSC8112TMP2400V
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 431-BFBGA, FCBGA |
| Operating Temperature | -40°C~105°C TJ |
| Packaging | Tray |
| Published | 2006 |
| Series | StarCore |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | SC140 Core |
| Reach Compliance Code | unknown |
| Base Part Number | MSC8112 |
| Interface | Ethernet, I2C, TDM, UART |
| Voltage - I/O | 3.30V |
| Non-Volatile Memory | External |
| Voltage - Core | 1.10V |
| On Chip Data RAM | 448kB |
| Clock Rate | 300MHz |
| RoHS Status | Non-RoHS Compliant |
MSC8112TMP2400V Overview
In electronic terms, it is a type of component that comes in the package of type 431-BFBGA, FCBGA .Tray is the packaging method provided.SC140 Core's wide range of applications makes it ideal for a wide variety of applications.The mounting of the device is done in the direction of Surface Mount.It is recommended that the device operate at a temperature of -40°C~105°C TJ to ensure its normal operation.The analog voltage range of 3.30V refers to the voltage that can be input or ouput.There are several digital signal processors in the StarCore series, including this one.Many related parts can be identified by using the MSC8112 part number as a base.
MSC8112TMP2400V Features
Supplied in the 431-BFBGA, FCBGA package
MSC8112TMP2400V Applications
There are a lot of NXP USA Inc. MSC8112TMP2400V DSP applications.
- Other sensor array processing
- Digital image processing
- Signal processing for telecommunications
- Infrared
- Geophysical processing
- Automobiles
- Consumer electronic gadgets
- Biomedical treatment
- Remote sensing image processing technology
- Instrument modeling
