Parameters |
Mounting Type |
Surface Mount |
Package / Case |
783-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~105°C TJ |
Packaging |
Tray |
Series |
StarCore |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
783 |
Type |
SC3400 Core |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Supply Voltage |
1V |
Terminal Pitch |
1mm |
Reach Compliance Code |
unknown |
Base Part Number |
MSC8144 |
JESD-30 Code |
S-PBGA-B783 |
Supply Voltage-Max (Vsup) |
1.05V |
Supply Voltage-Min (Vsup) |
0.97V |
Interface |
Ethernet, I2C, SPI, TDM, UART, UTOPIA |
Clock Frequency |
133MHz |
Boundary Scan |
YES |
Low Power Mode |
NO |
Format |
FIXED POINT |
Voltage - I/O |
3.30V |
Barrel Shifter |
NO |
Internal Bus Architecture |
MULTIPLE |
Non-Volatile Memory |
External |
Voltage - Core |
1.00V |
On Chip Data RAM |
10.5MB |
Clock Rate |
1GHz |
Height Seated (Max) |
3.176mm |
Length |
29mm |
Width |
29mm |
RoHS Status |
ROHS3 Compliant |
MSC8144SVT1000B Overview
In electronic terms, it is a type of component that comes in the package of type 783-BBGA, FCBGA .A packaging way of Tray is provided.Due to its membership in SC3400 Core, it is ideally suited for a wide range of uses.It is mounted in the direction of Surface Mount as shown in the image below.At the temperature of 0°C~105°C TJ, the device is guaranteed to operate normally.In analog circuits, the analog voltage range 3.30V represents the voltage range that is available for input or output.The StarCore series contains this digital signal processor.Its uses have 783 terminations.The voltage supplied by 1V is used to operate it.With its base part number of MSC8144, many related parts can be identified.It operates with a clock frequency of 133MHz.
MSC8144SVT1000B Features
Supplied in the 783-BBGA, FCBGA package
MSC8144SVT1000B Applications
There are a lot of NXP USA Inc. MSC8144SVT1000B DSP applications.
- Digital communications
- Statistical signal processing
- Automobile electronic gadgets
- Tomography technology
- Infrared
- Dam design
- Other sensor array processing
- Digital image processing, data compression
- Geoscience signal processing
- House construction