MSDM50-08
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Chassis Mount, Screw |
| Mounting Type | Chassis Mount |
| Package / Case | Module |
| Number of Pins | 5 |
| Diode Element Material | SILICON |
| Operating Temperature | -40°C~150°C TJ |
| Packaging | Bulk |
| Published | 2011 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 5 |
| Technology | Standard |
| Terminal Position | UPPER |
| Terminal Form | UNSPECIFIED |
| Pin Count | 5 |
| Number of Elements | 6 |
| Element Configuration | Single |
| Diode Type | Three Phase |
| Current - Reverse Leakage @ Vr | 300μA @ 800V |
| Voltage - Forward (Vf) (Max) @ If | 1.8V @ 150A |
| Case Connection | ISOLATED |
| Forward Current | 50A |
| Number of Phases | 3 |
| Peak Reverse Current | 300μA |
| Max Repetitive Reverse Voltage (Vrrm) | 1.8kV |
| Voltage - Peak Reverse (Max) | 800V |
| Breakdown Voltage-Min | 800V |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
See Relate Datesheet
