Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | MicroSMP |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2011 |
Series | eSMP® |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 175°C |
Min Operating Temperature | -55°C |
Additional Feature | LOW LEAKAGE CURRENT |
HTS Code | 8541.10.00.80 |
Subcategory | Rectifier Diodes |
Terminal Position | DUAL |
Terminal Form | FLAT |
Base Part Number | MSE1P |
Pin Count | 2 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 1μA @ 400V |
Voltage - Forward (Vf) (Max) @ If | 1.1V @ 1A |
Case Connection | CATHODE |
Forward Current | 1A |
Operating Temperature - Junction | -55°C~175°C |
Max Surge Current | 20A |
Output Current-Max | 1A |
Forward Voltage | 1.1V |
Max Reverse Voltage (DC) | 400V |
Average Rectified Current | 1A |
Reverse Recovery Time | 780 ns |
Peak Reverse Current | 1μA |
Max Repetitive Reverse Voltage (Vrrm) | 400V |
Capacitance @ Vr, F | 5pF @ 4V 1MHz |
Peak Non-Repetitive Surge Current | 20A |
Reverse Voltage | 400V |
Recovery Time | 780 ns |
Height | 730μm |
Length | 2.3mm |
Width | 1.4mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |