Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-219AD |
Number of Pins | 2 |
Diode Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2005 |
Series | TransZorb®, eSMP® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Termination | SMD/SMT |
ECCN Code | EAR99 |
Type | Zener |
Applications | General Purpose |
Subcategory | Transient Suppressors |
Max Power Dissipation | 1W |
Technology | AVALANCHE |
Terminal Position | DUAL |
Terminal Form | FLAT |
Peak Reflow Temperature (Cel) | 260 |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | MSP3V3 |
Pin Count | 2 |
Operating Supply Voltage | 3.3V |
Number of Elements | 1 |
Leakage Current | 200μA |
Element Configuration | Single |
Power Dissipation | 150W |
Power Line Protection | No |
Current - Peak Pulse (10/1000μs) | 87A 8/20μs |
Max Reverse Leakage Current | 200μA |
Voltage - Clamping (Max) @ Ipp | 11.5V |
Clamping Voltage | 11.5V |
Peak Pulse Current | 87A |
Reverse Standoff Voltage | 3.3V |
Max Surge Current | 75A |
Peak Pulse Power | 150W |
Direction | Unidirectional |
Test Current | 1mA |
Breakdown Voltage | 4.1V |
Reverse Breakdown Voltage | 4.1V |
Max Breakdown Voltage | 5.1V |
ESD Protection | Yes |
Max Junction Temperature (Tj) | 150°C |
Height | 730μm |
Length | 2.3mm |
Width | 1.4mm |
REACH SVHC | Unknown |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |