Parameters | |
---|---|
Memory Width | 64 |
Standby Current-Max | 0.064A |
Memory Density | 4294967296 bit |
Access Time (Max) | 0.7 ns |
I/O Type | COMMON |
Refresh Cycles | 8192 |
RoHS Status | ROHS3 Compliant |
Package / Case | 200-SODIMM |
Surface Mount | NO |
Number of Pins | 200 |
Published | 2005 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 200 |
Terminal Finish | MATTE TIN |
Subcategory | DRAMs |
Technology | CMOS |
Terminal Position | DUAL |
Terminal Form | NO LEAD |
Peak Reflow Temperature (Cel) | 225 |
Supply Voltage | 2.6V |
Terminal Pitch | 0.6mm |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Qualification Status | Not Qualified |
Operating Temperature (Max) | 70°C |
Power Supplies | 2.6V |
Temperature Grade | COMMERCIAL |
Memory Size | 512MB |
Speed | 400MT/s |
Memory Type | DDR SDRAM |
Supply Current-Max | 2.56mA |
Organization | 64MX64 |
Output Characteristics | 3-STATE |