Parameters | |
---|---|
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Package / Case | 200-SODIMM |
Surface Mount | NO |
Number of Pins | 200 |
Packaging | Bulk |
Published | 2004 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 200 |
Terminal Finish | Matte Tin (Sn) |
Max Operating Temperature | 70°C |
Min Operating Temperature | 0°C |
Subcategory | DRAMs |
Technology | CMOS |
Terminal Position | DUAL |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 1.8V |
Terminal Pitch | 0.6mm |
Time@Peak Reflow Temperature-Max (s) | 30 |
Operating Supply Voltage | 1.8V |
Temperature Grade | COMMERCIAL |
Memory Size | 128MB |
Speed | 400MT/s |
Memory Type | DDR2 SDRAM |
Supply Current-Max | 0.92mA |
Data Bus Width | 64b |
Organization | 16MX64 |
Output Characteristics | 3-STATE |
Memory Width | 64 |
Standby Current-Max | 0.02A |
Memory Density | 1073741824 bit |
Max Frequency | 400MHz |
Access Time (Max) | 0.6 ns |
I/O Type | COMMON |
Refresh Cycles | 8192 |
Height | 30mm |
Radiation Hardening | No |