Parameters |
Factory Lead Time |
1 Week |
Mount |
Through Hole |
Mounting Type |
Through Hole |
Package / Case |
20-DIP (0.300, 7.62mm) |
Number of Pins |
20 |
Operating Temperature |
0°C~70°C |
Packaging |
Tube |
Published |
2008 |
JESD-609 Code |
e3 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
20 |
Terminal Finish |
MATTE TIN |
Voltage - Supply |
4.75V~5.25V |
Terminal Position |
DUAL |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
30 |
Function |
PCM CODEC |
Operating Supply Voltage |
5V |
Interface |
PCM |
Operating Supply Current |
3mA |
Number of D/A Converters |
1 |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
MT8963AE1 Overview
A 20-DIP (0.300, 7.62mm) package is used to reduce board space requirements.A Tube-packing method is used to pack telecommunications equipment.In this case, Through Hole is the mounting type.The voltage supplied to 4.75V~5.25V can improve efficiency.0°C~70°C is a temperature setting that is reliable when telecom switching comes to performance.Mounted in the direction of Through Hole.There are 20 terminations can be found in telecom switching configuration.20 pins are located on this telecom interface.The supply voltage is 5V, which provides designers with a lot of flexibility.To give designers much flexibility, it uses 3mA as the supply current.
MT8963AE1 Features
Available in the 20-DIP (0.300, 7.62mm) package
Operating supply voltage of 5V
Operating supply current of 3mA
MT8963AE1 Applications
There are a lot of Microchip Technology MT8963AE1 Telecom applications.
- SDH Multiplexers
- ISDN Primary Rate Interfaces (PRA)
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- Digital Cross-Connect Systems
- DSLAMs
- Interfaces to SONET STS-1 Networks
- T1 Digital Cross Connects (DSX-1)
- CSU/DSU E1 Interface
- Public switching systems
- Frame Relay Switches and Access Devices (FRADS)