Parameters | |
---|---|
Mount | Socket |
Package / Case | 200-SODIMM |
Number of Pins | 200 |
Published | 2010 |
JESD-609 Code | e3 |
Pbfree Code | yes |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 200 |
Terminal Finish | MATTE TIN |
Max Operating Temperature | 70°C |
Min Operating Temperature | 0°C |
Additional Feature | SELF REFRESH; WD-MAX |
Subcategory | DRAMs |
Technology | CMOS |
Terminal Position | ZIG-ZAG |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 1.8V |
Terminal Pitch | 0.6mm |
Time@Peak Reflow Temperature-Max (s) | 30 |
Operating Supply Voltage | 1.8V |
Number of Elements | 8 |
Temperature Grade | COMMERCIAL |
Max Supply Voltage | 1.9V |
Min Supply Voltage | 1.7V |
Memory Size | 1GB |
Number of Ports | 1 |
Speed | 800MT/s |
Memory Type | DDR2 SDRAM |
Clock Frequency | 400MHz |
Data Bus Width | 64b |
Output Characteristics | 3-STATE |
Memory Width | 64 |
Standby Current-Max | 0.056A |
Max Frequency | 800MHz |
I/O Type | COMMON |
Access Mode | SINGLE BANK PAGE BURST |
Height Seated (Max) | 30.15mm |
Length | 67.6mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |