Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis Mount, Through Hole |
Mounting Type | Chassis Mount |
Package / Case | TO-244AB |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2013 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
Termination | Solder |
ECCN Code | EAR99 |
Max Operating Temperature | 105°C |
Min Operating Temperature | -40°C |
HTS Code | 8541.10.00.80 |
Pitch | 2.54mm |
Terminal Position | UPPER |
Orientation | Right Angle |
Terminal Form | UNSPECIFIED |
JESD-30 Code | R-PUFM-X2 |
Number of Contacts | 12 |
Number of Elements | 2 |
Element Configuration | Common Anode |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 25μA @ 50V |
Voltage - Forward (Vf) (Max) @ If | 1.3V @ 100A |
Operating Temperature - Junction | -55°C~150°C |
Max Surge Current | 800A |
Output Current-Max | 100A |
Application | SUPER FAST RECOVERY |
Current - Average Rectified (Io) | 200A DC |
Max Reverse Voltage (DC) | 200V |
Average Rectified Current | 200A |
Number of Phases | 1 |
Reverse Recovery Time | 75 ns |
Peak Reverse Current | 25μA |
Non-rep Pk Forward Current-Max | 2000A |
Reverse Voltage | 200V |
Diode Configuration | 1 Pair Common Anode |
RoHS Status | RoHS Compliant |