Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Material | Copper |
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Polyester |
Number of Positions or Pins (Grid) | 114 (13 x 13) |
Packaging | Bulk |
Published | 2010 |
Series | MVAS |
JESD-609 Code | e3 |
Feature | Open Frame |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | PGA |
Max Operating Temperature | 125°C |
Min Operating Temperature | -55°C |
Gender | Female |
Additional Feature | ULTRA LOW INSERTION FORCE |
HTS Code | 8536.69.40.40 |
Contact Finish - Mating | Gold |
Orientation | Straight |
Terminal Pitch | 2.54mm |
Depth | 33.02mm |
Current Rating | 1A |
Pitch - Mating | 0.100 2.54mm |
Number of Contacts | 114 |
PCB Contact Pattern | RECTANGULAR |
Body Breadth | 1.3 inch |
Contact Style | RND PIN-SKT |
Contact Resistance | 10mOhm |
Insulation Resistance | 5000000000Ohm |
Mating Contact Pitch | 0.1 inch |
Dielectric Withstanding Voltage | 1000VAC V |
PCB Contact Row Spacing | 0.1 mm |
Pitch - Post | 0.100 2.54mm |
Contact Configuration | 13X13 |
Length | 33.02mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 30.0μin 0.76μm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |